Трехфазный диодный мост; Urmax: 1,6кВ; If: 68А; Ifsm: 300А; THT Технические параметры
- Case: SLIM-PAC™
- Electrical mounting: THT
- Features of semiconductor devices: glass passivated
- Kind of package: bulk
- Leads: wire Ø 0.75mm
- Load current: 68A
- Manufacturer: POWERSEM
- Max. forward impulse current: 300A
- Max. forward voltage: 1.46V
- Mechanical mounting: screw
- Off state voltage max.: 1.6kV
- Semiconductor structure: diode/diode
- Type of semiconductor component: three-phase bridge rectifier
- Version: module